LED penetration in lighting applications increases CSP into a development focus

LED is also a very important part of Taiwan's technology industry. With the increasing penetration of LEDs in lighting applications, many large companies are also beginning to think about introducing LED technology into other terminal applications, and this year's summit forum, all In addition to focusing on market opportunities and end-use applications, it is interesting to note that CSP (Chip Scale Package) technology has also become one of the focuses of forum speakers.

Speaking of CSP technology, Ralph Bertram, director of product definition for OSG Opto Semiconductors' Solid State Lighting Division, said that OSRAM Opto Semiconductors has an outstanding performance in this field, but everyone should consider whether CSP is the only solution for lighting applications? Ralph Bertram pointed out In terms of power and lumens/US dollars to divide product positioning, each big factory actually has a similar product layout. But does CSP really correspond to all product aspects?

Ralph Bertram believes that the LED chip packaging method is quite diverse, and many of them adopt the vertical flip chip (FilpChip) package method, most of which are quite expensive, but if other packaging methods are adopted, although the cost can be effectively reduced, the efficiency is Performance may have made some discounts, Ralph Bertram further said that if the industry can work together to create a new ecosystem and further work on the problems faced by packaging technology, it may be possible to solve the problem.

Continuing Ralph Bertram's discussion on CSP technology, Xie Wenfeng, vice president of Asia Pacific, Liangrui Trading Co., Ltd. expressed a more optimistic view. Xie Wenfeng further said that CSP is not a new technology. In the semiconductor field, the technology has developed. For a short period of time, it is only used in LED packaging and terminal applications, such as smart phone flash, directional light source, omnidirectional light source, street light and patio light, etc., are the space where CSP can volatilize. Xie Wenfeng also took Philips's lamp display as an example to illustrate the benefits of flip chip packaging technology, such as heat dissipation and illumination, and the performance is excellent. At the same time, the integration and area are quite excellent. which performed.

However, although the development of CSP has been going on for a long time, will the technology developed by major manufacturers be plagiarized? Xie Wenfeng believes that because CSP involves a wide range of scope, from the perspective of system integration, each ring The knots are interlocked, and light is a heat issue. It takes a lot of work to optimize. This involves a lot of knowledge, so it is unlikely that this will happen.

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