[Brand Power • Hongli Photoelectric] LED lighting mainstream devices and development trends
At present, the form of LED packaging devices is changing with each passing day. From SMD to COB, from flip-chip to chipless packaging, it has injected a lot of new vitality into the development of the industry. Nowadays, the mainstream lamp bead 2835 is also the main product of Hongli. It can be widely used in the production of bulbs, downlights, PAR lamps, panel lamps, lamps, mining lamps and other products, covering power from 0.1W to 2W.
The first trend is the flip-chip process, which has solderless wire, better reliability, low thermal resistance, and overcurrent use. It can use eutectic process, silver glue process, solder paste process, etc., and the market competitiveness is good.
The second trend is flip-chip COB and high-density LED array new products. Its unique structure and performance provide more possibilities for LED lighting in high lumen density applications.
The third trend is flip-chip discrete devices for applications such as cell phone flash, TV backlighting, and lighting. The use of flip chip process, with higher current carrying capacity, higher unit area brightness output; its thermal resistance is about 6 ° C / W, better thermal conductivity; using phosphor molding technology, better consistency.
The fourth trend is the AC module, which has the characteristics of low cost, PF value greater than 0.95, THD less than 20%, and convenient assembly, which is convenient for later replacement and maintenance.
.jpg)
Wang Gaiyang, Director of Hongli Optoelectronics Products
The first trend is the flip-chip process, which has solderless wire, better reliability, low thermal resistance, and overcurrent use. It can use eutectic process, silver glue process, solder paste process, etc., and the market competitiveness is good.
The second trend is flip-chip COB and high-density LED array new products. Its unique structure and performance provide more possibilities for LED lighting in high lumen density applications.
The third trend is flip-chip discrete devices for applications such as cell phone flash, TV backlighting, and lighting. The use of flip chip process, with higher current carrying capacity, higher unit area brightness output; its thermal resistance is about 6 ° C / W, better thermal conductivity; using phosphor molding technology, better consistency.
The fourth trend is the AC module, which has the characteristics of low cost, PF value greater than 0.95, THD less than 20%, and convenient assembly, which is convenient for later replacement and maintenance.
With the fast growth of intelligent electrical appliances, electric vehicle and industrial automation, more and more sensors applied to make different Sensor Cable assemblies. Manufactures show much high requirements for the sensor function and quality. As one professional sensor assembly solution provider, Feyvan Electronics has rich experience on Temperature Sensor manufacturing.
Sensor Cable Assembly
Sensor Cable Assembly,Sensor Harness,Sensor Cable,Cable Harness Assemblies
Feyvan Electronics Technology Co., Ltd. , http://www.fv-cable-assembly.com