2014 Gaogong LED Annual Meeting: Huateng Semiconductor Zhuo Weihuang talks about "EMC Packaging Test"
[Text|High-tech LED reporter Yang Jinglin] At present, EMC new bracket plastic material called "third generation LED package bracket" has been introduced into the packaging industry. Different from PPA and ceramic substrates, EMC packaging with epoxy resin can achieve large-scale production, cost-effective, flexible design, smaller size, and easier to cut.
At the same time, EMC stent molding materials also have the advantages of high stability against UV, high temperature, and low expansion coefficient. Therefore, the bracket manufacturers and the backlight market at home and abroad gradually switch to EMC brackets, and this trend has also appeared to a large extent. Lighting market.
In response to changes in packaging materials and packaging processes, various businesses rely on a keen market sense to seek opportunities in the market at the time of EMC packaging, and strive to seize business opportunities with the fastest market reaction and seize market share in advance.
Shenzhen Huateng Semiconductor Equipment (hereinafter referred to as “HuaTengâ€) is the first to develop the corresponding EMC packaging and testing equipment for the characteristics of EMC packaging, to ensure the quality, yield and integrity of the finished product. The launch of this device highlights Huateng's deep technical strength and represents the future technological development direction of EMC packaging.
Zhuo Weihuang, director of R&D at Huateng, said, "Compared with the EMC package test launched last year, this device can reach a speed of 25k-35k this year. The efficiency has been greatly improved,"
"Although the sales volume of our EMC packaging and testing equipment is not large at present, we expect that in the market in 2015, both EMC and EMC supporting products will show explosive growth." Zhuo Weihuang said that after a few years of LED Manufacturers in the development of EMC packaging products and marketing of EMC supporting products, the market prospects for next year will be very clear.
As the industry's highest specification and largest industry event in the LED industry, it is also the best platform for the annual LED industry's year-end review, analysis and outlook. So far, the high-tech LED conference has been successfully held for four sessions. The 5th High-tech LED Conference will also be held at the Guanlan Lake Dongguan Club in Shenzhen on December 12-13, 2014.
Huaiteng R&D Director Zhuo Weihuang will share the "EMC Packaging Test" with you at the "Technology Driven Supply Chain Transformation New Opportunities" sub-forum titled by Liyang Optoelectronics on the morning of December 13th, 2014. Keynote speech, stay tuned!
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At the same time, EMC stent molding materials also have the advantages of high stability against UV, high temperature, and low expansion coefficient. Therefore, the bracket manufacturers and the backlight market at home and abroad gradually switch to EMC brackets, and this trend has also appeared to a large extent. Lighting market.
In response to changes in packaging materials and packaging processes, various businesses rely on a keen market sense to seek opportunities in the market at the time of EMC packaging, and strive to seize business opportunities with the fastest market reaction and seize market share in advance.
Shenzhen Huateng Semiconductor Equipment (hereinafter referred to as “HuaTengâ€) is the first to develop the corresponding EMC packaging and testing equipment for the characteristics of EMC packaging, to ensure the quality, yield and integrity of the finished product. The launch of this device highlights Huateng's deep technical strength and represents the future technological development direction of EMC packaging.
Zhuo Weihuang, director of R&D at Huateng, said, "Compared with the EMC package test launched last year, this device can reach a speed of 25k-35k this year. The efficiency has been greatly improved,"
"Although the sales volume of our EMC packaging and testing equipment is not large at present, we expect that in the market in 2015, both EMC and EMC supporting products will show explosive growth." Zhuo Weihuang said that after a few years of LED Manufacturers in the development of EMC packaging products and marketing of EMC supporting products, the market prospects for next year will be very clear.
As the industry's highest specification and largest industry event in the LED industry, it is also the best platform for the annual LED industry's year-end review, analysis and outlook. So far, the high-tech LED conference has been successfully held for four sessions. The 5th High-tech LED Conference will also be held at the Guanlan Lake Dongguan Club in Shenzhen on December 12-13, 2014.
Huaiteng R&D Director Zhuo Weihuang will share the "EMC Packaging Test" with you at the "Technology Driven Supply Chain Transformation New Opportunities" sub-forum titled by Liyang Optoelectronics on the morning of December 13th, 2014. Keynote speech, stay tuned!
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