**New Cable Assemblies Power Intel® Omni-Path Architecture**
Shanghai, China – August 3, 2017 – TE Connectivity, a global leader in connectivity and sensing solutions, today announced the launch of its innovative ChipConnect internal faceplate-to-processor cable assembly. Specifically designed for the Intel Omni-Path Architecture (OPA), this product enables seamless connection to the LGA 3647 socket on the processor and the Intel Omni-Path internal faceplate transition port on the panel, supporting data transfer speeds of up to 25 Gbps per second. By eliminating the need for costly, low-loss printed circuit board (PCB) materials and associated reset timers for signal routing, the ChipConnect cable assemblies reduce both system design time and overall costs. Furthermore, by simplifying the complexity of PCB laminates and wiring, this product streamlines the entire system design process.
The ChipConnect component offers standard lengths and breakpoints, with the added flexibility of customization for specific applications. These new cable assemblies provide 4X and 8X high-speed data transmission channels, along with linear and right-angle (left/right exit) linear edge connector (LEC) cable plugs, catering to diverse cable routing requirements. Alongside the cable assemblies, TE Connectivity also offers a compatible range of LGA 3647 sockets and hardware products, including the P0 socket and P1 socket. TE Connectivity stands out as one of the few Intel-certified first-generation IFP cable component suppliers and plays a key role as a co-developer of Intel OPA’s next-generation cable component designs.
“Intel’s OPA architecture has set a new industry benchmark, and our ChipConnect products provide unparalleled design flexibility and enhanced performance for such applications,†said Ann Ou, Product Manager at TE Connectivity's Data and End Devices Division. “With this launch, TE Connectivity becomes a one-stop supplier for socket and cable assemblies that meet OPA standards.â€
For more information, visit [www.TE.com/ChipConnect](http://www.TE.com/ChipConnect).
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**About TE Connectivity**
TE Connectivity (NYSE: TEL) is a global technology giant with annual revenues exceeding $12 billion. We are dedicated to driving innovation and advancing industries such as transportation, industrial applications, medical technology, energy, data communications, and home solutions. Our industry-leading connectivity and sensing solutions are engineered to perform reliably in even the harshest environments, helping build a safer, greener, smarter, and more connected world. With approximately 75,000 employees globally, over 7,000 of whom are engineers, we collaborate with customers across nearly 150 countries. At TE Connectivity, we believe in “Infinite Possibilities, One Connection.†For further details, visit [www.te.com](http://www.te.com).
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