**New Cable Assemblies Power Intel® Omni-Path Architecture**
**Shanghai, China – August 3, 2017 –** TE Connectivity (TE), a global leader in connectivity and sensors, announced today the launch of its innovative ChipConnect internal faceplate-to-processor cable assembly. Designed specifically for the Intel Omni-Path Architecture (OPA), this product enables direct interfacing with the LGA 3647 socket on the processor and the Intel Omni-Path internal faceplate transition port on the panel, supporting data transfer speeds of up to 25 Gbps per second. The ChipConnect cable assemblies eliminate the need for costly, low-loss printed circuit board (PCB) materials and associated reset timers for signal routing, significantly reducing both system design time and costs. By simplifying PCB laminates and wiring, this product streamlines system design processes.
The ChipConnect component comes in standard lengths and breakpoints, with customization options available for specific applications. These new cable assemblies feature 4X and 8X high-speed data transmission channels, along with linear and right-angle (left/right exit) linear edge connector (LEC) cable plugs to accommodate various cable routing requirements. In addition to cable assemblies, TE also offers a complementary range of LGA 3647 sockets and hardware products, including P0 and P1 sockets. TE is among the few Intel-certified first-generation IFP cable component suppliers and collaborates closely with Intel on the development of next-generation cable components for OPA.
"Intel’s OPA architecture has established itself as the industry standard, and our ChipConnect products provide greater design flexibility and superior performance for such applications," said Ann Ou, Product Manager at TE's Data and End Devices Division. "Following the product launch, TE will emerge as a one-stop supplier for sockets and cable assemblies that meet OPA standards."
For further details, visit [www.TE.com/ChipConnect](http://www.TE.com/ChipConnect).
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**ABOUT TE CONNECTIVITY**
TE Connectivity (NYSE: TEL) is a global technology powerhouse with annual revenues exceeding $12 billion. We are dedicated to fostering innovation and driving advancements across transportation, industrial applications, medical technology, energy, data communications, and smart homes. Our industry-leading connectivity and sensor solutions have been proven reliable in challenging environments, helping build a safer, greener, smarter, and more connected world. TE employs approximately 75,000 people globally, with over 7,000 engineers collaborating across nearly 150 countries. At TE, we believe in "Infinite Possibilities in One." For more information, visit [www.te.com](http://www.te.com).
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This new product not only addresses current market demands but also sets the stage for future innovations in high-performance computing. TE Connectivity continues to lead by example, offering cutting-edge solutions that empower industries worldwide.
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