German research project CoSiP lays the foundation for SiP development
As the complexity of microelectronic systems increases, the development of chips, packages, and PCBs must be coordinated at an early stage, especially for system-in-package (SiP) applications. In order to study this end-to-end SiP design environment, Infineon Technologies AG works with partners such as AmicAngewandteMicro-Messtechnik GmbH, Fraunhofer Institute, Bosch Automotive Electronics, Siemens Academia Sinica and Siemens Healthcare. Co-developing CoSiP research projects. CoSiP means the development of a highly compact, energy-efficient compact system using the collaborative design of a chip-package system. The project is funded by the German Federal Ministry of Education and Research (BMBF) and is scheduled to be completed by the end of 2012.
As part of the project, five partners will develop new design methods to enable the development and installation of SiP components—two or more chips integrated in the same chip package. The development is performed synchronously, so that the matching between the chip and the PCB board is achieved by adjusting the chip. The goal of each project partner is to lay the foundation for the design tools required for SiP development. The research results of the project will help ensure optimal use of existing and future SiP application technologies. After the completion of the project, the development time of SiP products may be shortened by at least one-third. Siemens Medical and Academia Sinica will apply the research results to medical technology, and Bosch will introduce the results into the automotive industry.
In the past, it was customary to independently and independently develop the three major design areas of SiP--chip, chip package and PCB board. There is generally no connection between chip development and chip package or PCB board development. Moreover, the three major The optimization of system components is also carried out separately. However, the development of system development requires the coordinated design of chips, chip packages and systems in an end-to-end manner coordinated with each other. The CoSiP research project is paving the way for this goal.
Four private sector partners are responsible for 50% of the funds required for the CoSiP research project. As part of the German Federal Government's High Technology Strategy and Funding Program IKT2020, the German Federal Ministry of Education and Research provides an additional 50% of the project funding for the project. One of the goals of the IKT2020 program is to promote the development of microchips, making them an interdisciplinary, fundamental technology and consolidating and strengthening Germany's technological leadership in the information and communications arena.
During the implementation of the project, we worked closely with the chip/package system under the European Microelectronics Application Development Program, a co-designer for compact system-level packaging solutions.
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