Abstract: This application note discusses the communication technology of a microcontroller as one of the cores of today's advanced electronic products and one or more peripheral devices. Previously, the peripherals of the microcontroller were connected to the data and…
Title: Haitang Bonded Port Area East Centralized Inspection Area LED Large Screen Change Announcement Tender No.: 2009-HCGK-91 Announcement Date: April 16, 2009 Deadline: April 29, 2009 Tendering Agency: Xiamen Haicang Bonded Minato City Investment Co…
A simple comparison of SD and HD digital TV
First of all, the production cost of high-definition television is higher than that of standard-definition programming. Therefore, the source of the program will be a big bottleneck for high-definition television, and…
Recently, Bolton Electric's 2007 mid-year marketing conference was successfully held at the company's headquarters. More than 60 people from the General Manager, Marketing Department, Sales Department and other department managers, regiona…
Core Tip: At the recent International Nanotechnology Showcase & Seminar, Toshiba demonstrated a new technology that can significantly improve the light extraction efficiency of OLED TVs and lighting equipment. In a speech, the head of Middle East …
Professor Fujiwara Kanehara, a professor of materials production science at the Graduate School of Engineering, Osaka University, has produced a red LED module using GaN-based semiconductors. Blue LED components and green LED components using GaN-base…
Title: Guangxi Power Plant LED Display Project Competitive Negotiation Announcement Tender No.: J2009101 Announcement Date: July 7, 2009 Deadline: July 15, 2009 Tendering Agency: Hai'an Zhenguang Power Station Province: Jiangsu Province - Nantong …
At present, the heat dissipation problem of LED applications is the biggest headache for LED manufacturers. The heat dissipation substrate is a medium for providing heat conduction, LED→heat dissipation substrate→heat dissipation m…
Abstract: PCB layout technology can be used to optimize the RF noise suppression capability of audio amplifier ICs. Here we will use Maxim's MAX9750 IC for example analysis.