Maxim Integrated Products has launched a cutting-edge SiGe I/Q modulator and digital RF variable gain amplifier (VGA) chipset specifically designed for GSM/EDGE base station applications. The MAX2021/MAX2023 I/Q modulators, paired with the MAX2058/MAX2059 VGA, offer the lowest noise and highest linearity in the industry when compared to other direct conversion (Zero IF) transmitter solutions. This makes them ideal for high-performance wireless infrastructure systems that require both precision and efficiency.
In today’s wireless infrastructure landscape, there is increasing pressure to maintain or even enhance performance while simultaneously reducing costs. Design engineers are constantly seeking more cost-effective and compact solutions, aiming to minimize component count, board space, and overall design complexity. For GSM/EDGE base transceiver systems, a direct baseband-to-RF (zero-IF) architecture is often the most cost-efficient choice. However, due to strict spectral mask requirements, zero-IF architectures have traditionally been limited to lower-performance handheld devices.
With the introduction of the MAX2021/MAX2023 I/Q modulators and MAX2058/MAX2059 RF digital VGAs, this long-standing performance barrier in GSM zero-IF designs has been overcome. When combined with Maxim’s dual-channel DAC, the MAX5873, and quad-channel amplifier, the MAX4395, these components form the industry’s first groundbreaking digital baseband-to-RF VGA chipset. It meets the demanding spectral masking and noise requirements for single-carrier GSM850/900 and DCS1800/PCS1900 EDGE base stations.
By cascading the entire chipset, the system delivers +15dBm output power, +32dBm OIP3, and an ultra-low output noise level of < -156dBc/Hz under 6MHz. The LO leakage after zeroing is less than -40dBc across a wide temperature range of -40°C to +85°C. The SPI-controlled RF digital VGA provides full gain control, along with two on-chip attenuators offering 12dB static control, 30dB dynamic control, and over 10dB compensation, ensuring precise signal adjustment in real-world conditions.
Excellent modulator performance
The outstanding noise and linearity performance of the chipset is largely attributed to the new zero-IF I/Q modulators, the MAX2021 and MAX2023. These modulators achieve an output noise density of -174dBm/Hz, nearly reaching the theoretical thermal limit. This performance is further enhanced by 10dB compared to the best modulator/demodulator available previously. Additionally, the MAX2021/MAX2023 exhibit impressive OIP2, OIP3, and OP1dB levels of 57.9dBm/61dBm, 22.3dBm/23.5dBm, and 16.7dBm/14.3dBm, respectively. Considering both noise performance and P1dB values, the total dynamic range exceeds 190.7dB/188.3dB, surpassing competitors by 16.7dB/14.3dB. These improvements directly enhance the spectral mask performance of the BTS transmitter, allowing the MAX2021/MAX2023 to meet stringent GSM/EDGE BTS requirements without the need for expensive transmit stencil filters, which can cost around $2.00 each (over 100k units).
Highly integrated RF digital VGA delivers exceptional performance
The performance of the MAX2058/MAX2059 RF digital VGAs is equally impressive. They offer a total adjustment range of 62dB/56dB, an output power of +15dBm, and an OIP3 of 32.3dBm/31.8dBm. Their spurious emission power is as low as -39.2dBc/-39.1dBc at 200kHz. What makes these VGAs stand out is their high level of integration. In addition to including two digital attenuators and two-stage RF amplifiers, they also feature an on-chip SPI decoder, two loopback switches, and a sophisticated loopback mixer. When used with Maxim’s MAX9491 synthesizer, the loopback mixer allows for easy frequency adjustment, enabling the transmitted signal to fall directly into the receive band. This unique feature enables real-time diagnostic monitoring of both transmit and receive links, improving system reliability and maintenance efficiency.
Tx chipset greatly reduces component count and cost
Maxim’s four-chip solution significantly reduces the number of components required compared to traditional zero-IF transmitter architectures. When compared to conventional two-upconversion designs, this new solution replaces six functions, resulting in a 65% reduction in net cost relative to the replaced components. The chipset occupies only 26mm x 27mm of board space, saving 50% of the space needed for comparable circuits. These cost and space savings make it an ideal choice for next-generation GSM/EDGE designs where cost and density are critical factors.
The MAX2021/MAX2023 are available in 36-pin TQFN packages, while the MAX2058/MAX2059 come in 40-pin TQFN packages. Pricing starts at $4.98 for the MAX2021/MAX2023 (for orders over 1,000 pieces, FOB USA), and $7.96 for the MAX2058/MAX2059 (also for orders over 1,000 pieces, FOB USA). These competitive prices make the chipset an attractive option for designers looking to build high-performance, cost-effective GSM/EDGE base stations.
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